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                      Cutting pcb board,Laser cut pcb board,pcb board circuit de-panelling machine-Buy V Cut Pcb Depaneling,Pcb V Cut Machine,Pcb Making Machine Product on pcbcutting.com
                      Cutting pcb board,Laser cut pcb board,pcb board circuit de-panelling machine-Buy V Cut Pcb Depaneling,Pcb V Cut Machine,Pcb Making Machine Product on pcbcutting.com
                      Cutting pcb board,Laser cut pcb board,pcb board circuit de-panelling machine-Buy V Cut Pcb Depaneling,Pcb V Cut Machine,Pcb Making Machine Product on pcbcutting.com
                      Product Details:
                      • Delivery Time:15 days
                      • Packaging Details:wooden case
                      Payment & Shipping Terms:
                      • Payment Terms:L/C,D/A,D/P,T/T,Western Union
                      • Port:shenzhen
                      • Supply Ability:10 Set/Sets per Week
                      • Min.Order Quantity:1 Set/Sets
                       
                      Detailed Product Description
                      • Cooling Mode:Air Cooling
                      • Cutting Area:1000mm*940mm *1520 mm
                      • Laser Type: CO2
                      • After-sales Service Provided :Engineers available to service machinery overseas
                      • Graphic Format Supports:BMP, DWG, DXF, LAS, Other
                      • Cutting Speed:≥150 mm/s
                      • Cooling Mode :Air Cooling
                      • CNC or Not:CNC or Not:Yes
                      • Cutting Thickness:0-30mm
                      • Applicable Material:PCB
                      • Application:Laser Cutting
                      • Power:220V 380v
                      • Laser: USA Brand Optowave
                      • Certification:CE, GS, SGS, UL, Other
                      • Model Number:YSATM-4C
                      • Brand Name:YUSHLI
                      • Place of Origin :Jiangsu, China (Mainland)

                      PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

                      Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate

                      Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

                      • Damages and fractures to substrates and circuits due to mechanical stress
                      • Damages to PCB due to accumulated debris
                      • Constant need for new bits, custom dies, and blades
                      • Lack of versatility – each new application requires ordering of custom tools, blades, and dies
                      • Not good for high precision, multi-dimensional or complicated cuts
                      • Not useful PCB depaneling/singulation smaller boards

                      Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

                       

                      Advantages of Laser PCB depaneling/singulation

                      • No mechanical stress on substrates or circuits
                      • No tooling cost or consumables.
                      • Versatility – ability to change applications by simply changing settings
                      • Fiducial Recognition – more precise and clean cut
                      • Optical Recognition before PCB depaneling/singulation process begins.
                      • Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
                      • Extraordinary cut quality holding tolerances as small as < 50 microns.
                      • No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

                      Specification

                      Laser class 1
                      Max. working area (X x Y x Z) 300 mm x 300 mm x 11 mm
                      Max. recognition area (X x Y) 300 mm x 300 mm
                      Max. material size (X x Y) 350 mm x 350 mm
                      Data input formats Gerber, X-Gerber, DXF, HPGL,
                      Max. structuring speed Depends on application
                      Positioning accuracy ± 25 μm (1 Mil)
                      Diameter of focused laser beam 20 μm (0.8 Mil)
                      Laser wavelength 355 nm
                      System dimensions (W x H x D) 1000mm*940mm
                      *1520 mm
                      Weight ~ 450 kg (990 lbs)
                      Operating conditions  
                      Power supply 230 VAC, 50-60 Hz, 3 kVA
                      Cooling Air-cooled (internal water-air cooling)
                      Ambient temperature 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
                      (71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
                      Humidity < 60 % (non-condensing)
                      Required accessoires Exhaust unit

                       

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                      Related Product
                        Cutting pcb board,Laser cut pcb board,pcb board circuit de-panelling machine-Buy V Cut Pcb Depaneling,Pcb V Cut Machine,Pcb Making Machine Product on pcbcutting.com
                        Product Details:
                        • Delivery Time:15 days
                        • Packaging Details:wooden case
                        Payment & Shipping Terms:
                        • Payment Terms:L/C,D/A,D/P,T/T,Western Union
                        • Port:shenzhen
                        • Supply Ability:10 Set/Sets per Week
                        • Min.Order Quantity:1 Set/Sets
                        Detailed Product Description
                        • Cooling Mode:Air Cooling
                        • Cutting Area:1000mm*940mm *1520 mm
                        • Laser Type: CO2
                        • After-sales Service Provided :Engineers available to service machinery overseas
                        • Graphic Format Supports:BMP, DWG, DXF, LAS, Other
                        • Cutting Speed:≥150 mm/s
                        • Cooling Mode :Air Cooling
                        • CNC or Not:CNC or Not:Yes
                        • Cutting Thickness:0-30mm
                        • Applicable Material:PCB
                        • Application:Laser Cutting
                        • Power:220V 380v
                        • Laser: USA Brand Optowave
                        • Certification:CE, GS, SGS, UL, Other
                        • Model Number:YSATM-4C
                        • Brand Name:YUSHLI
                        • Place of Origin :Jiangsu, China (Mainland)

                        PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

                        Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate

                        Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

                        • Damages and fractures to substrates and circuits due to mechanical stress
                        • Damages to PCB due to accumulated debris
                        • Constant need for new bits, custom dies, and blades
                        • Lack of versatility – each new application requires ordering of custom tools, blades, and dies
                        • Not good for high precision, multi-dimensional or complicated cuts
                        • Not useful PCB depaneling/singulation smaller boards

                        Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

                         

                        Advantages of Laser PCB depaneling/singulation

                        • No mechanical stress on substrates or circuits
                        • No tooling cost or consumables.
                        • Versatility – ability to change applications by simply changing settings
                        • Fiducial Recognition – more precise and clean cut
                        • Optical Recognition before PCB depaneling/singulation process begins.
                        • Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
                        • Extraordinary cut quality holding tolerances as small as < 50 microns.
                        • No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

                        Specification

                        Laser class 1
                        Max. working area (X x Y x Z) 300 mm x 300 mm x 11 mm
                        Max. recognition area (X x Y) 300 mm x 300 mm
                        Max. material size (X x Y) 350 mm x 350 mm
                        Data input formats Gerber, X-Gerber, DXF, HPGL,
                        Max. structuring speed Depends on application
                        Positioning accuracy ± 25 μm (1 Mil)
                        Diameter of focused laser beam 20 μm (0.8 Mil)
                        Laser wavelength 355 nm
                        System dimensions (W x H x D) 1000mm*940mm
                        *1520 mm
                        Weight ~ 450 kg (990 lbs)
                        Operating conditions  
                        Power supply 230 VAC, 50-60 Hz, 3 kVA
                        Cooling Air-cooled (internal water-air cooling)
                        Ambient temperature 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
                        (71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
                        Humidity < 60 % (non-condensing)
                        Required accessoires Exhaust unit

                         

                        YUSH Electronic Technology Co.,Ltd. Pomeas Optical Technology Copyright 2016
                        CONTACT US
                        YUSH Electronic Technology Co.,Ltd.
                        Contacts:Eva Liu +86 13416743702
                        Tel:86-0512-62751429
                        Skype:evaliuhuan
                        Email:sales@yushunli.com evaliu@hk-yush.com
                        Company Address:3 Building NO 11,Chunhui Road,
                        Suzhou Industrial Park,Jiangsu Province,China.
                        YUSH Electronic Technology Co.,Ltd. Pomeas Optical Technology Copyright 2016